45
High-current contact elements
High-current contact bush, in surface mount technology (SMT), for pin contacts 3.0–4.0 mm, for printed circuit boards or busbars
| State: | New, under preparation |
Technical Data
Environmental conditions
Temperature range: -40 °C/+150 °C
Materials
Contact: Cu alloy, tin/silver-plated
Mechanical data
Mating with: round pin contact, diameter 3–4 mm
applicable for reflow soldering on printed circuit board
applicable for laser welding on a busbar or lead frame
Mating cycles: ≤ 5
Insertion force: 30 N ± 12 N – top entry
32 N ± 12 N – bottom entry
Withdrawal force: 19 N ± 7 N
Electrical data (at Tamb 20 °C)
Contact resistance: < 0.5 mΩ
Rated current: 115 A *1
1) depending on the connection to the printed circuit board/busbar, installation situation and heat dissipation