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High-current contact elements
High-current contact bush with positioning peg, in surface mount technology (SMT), mateable from top, bottom or lateral direction, for tab contacts 0.5–0.8 mm, for printed circuit boards or busbars
| 批准 | LV 215, VW 80332 |
技术数据
环境条件
Temperature range: -40 °C/+125 °C
物料
Contact: CuCr alloy, tin-plated
机械数据
Mating with: tab contact 2.8–6.8 mm x 0.5 mm – 4580 01 MP T0,5
tab contact 2.8–6.8 mm x 0.6 mm – 4580 01 MP T0,6
tab contact 2.8–6.8 mm x 0.8 mm – 4580 01 MP T0,8
applicable for reflow soldering on printed circuit board
applicable for laser welding on a busbar or lead frame
Mating cycles: ≤ 5
Insertion force: tab 0.5/0.6 mm
25 N ± 15 N – top/bottom entry
18 N ± 10 N – lateral entry
tab 0.8 mm
35 N ± 15 N – top/bottom entry
18 N ± 10 N – lateral entry *1
Withdrawal force: tab 0.5/0.6 mm
25 N ± 12 N – top/bottom entry
15 N ± 10 N – lateral entry
tab 0.8 mm
35 N ± 10 N – top/bottom entry
15 N ± 10 N – lateral entry *2
1) measured with a tin-plated test tab
2) measured with a tin-plated test tab
电气数据（Tamb 20 °C）
Contact resistance: < 1 mΩ
Rated current: ≤ 56 A *1
1) depending on the connection to the printed circuit board/busbar, installation situation and heat dissipation