30 302299

Micromodul™ connectors, pitch 1.27 mm

Micromodul™ connector for direct mating, insulation displacement technology (IDT), with locking on printed circuit board by means of locking hooks and toes, with closed sides

批准 VDE

规格书(PDF)

技术数据

环境条件

Temperature range: -40 °C/+130 °C  *1

1) upper limit temperature (insulating body) RTI (electrical) of the UL Yellow Card

物料

Insulating body: PA GF, V-0 according to UL94  *1

Contact spring: CuSn, pre-nickel and tin-plated – 302299
CuSn, pre-nickel-plated, gold-plated in cotact area, tin-plated in insulation displacement area – 302299 V122

1) component glow wire resistant (GWT 750 °C), testing acc. to IEC 60695-2-11, assessment acc. to IEC 60335-1 (flame < 2 s)

机械数据

Mating with: printed circuit board 1.6 ± 0.14 mm

Insertion force/contact: < 1,3 N

Withdrawal force/contact: > 0,3 N

IDT区域可连接的导线

Construction: flat cable 1.27 mm

Section min.: AWG 28 (0.090 mm²)

Section max.: AWG 26 (0,140 mm²)

Insulation diameter: 1,0 mm

电气数据(Tamb 20 °C)

Contact resistance: ≤ 5 mΩ

Rated current: 1,2 A bei TU 85 °C

Rated voltage: 125 V AC

线束组装设备

批准的电线

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芯数/产品查询

名称 芯数 包装单位
(套)
最小交货
(套)
索取报价
(份)
库存
(套)
302299 0441,3001,300
302299 0661,3001,300
直接查询处:

JIT, DE562

302299 0881,3001,300
302299 10101,3001,300
直接查询处:

JIT, DE1,300

302299 12121,3001,300
302299 14141,3001,300
302299 16161,3001,300
302299 18181,3001,300
302299 20201,3001,300
302299 22221,3001,300
302299 04 V12241,3001,300
直接查询处:

JIT, DE1,300

Arrow, DE1,300

302299 06 V12261,3001,300
302299 08 V12281,3001,300
302299 10 V122101,3001,300
302299 12 V122121,3001,300
302299 14 V122141,3001,300
302299 16 V122161,3001,300
302299 18 V122181,3001,300
302299 20 V122201,3001,300
302299 22 V122221,3001,300

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